1. 2. 3. material content data sheet sales product name bsz0501nsi issued 7. may 2015 ma# ma001300772 package pg-tsdson-8-26 weight* 35.56 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.393 1.10 1.10 11040 11040 leadframe inorganic material phosphorus 7723-14-0 0.004 0.01 102 non noble metal zinc 7440-66-6 0.015 0.04 409 non noble metal iron 7439-89-6 0.291 0.82 8176 non noble metal copper 7440-50-8 11.804 33.20 34.07 331988 340675 wire non noble metal copper 7440-50-8 0.013 0.04 0.04 379 379 encapsulation organic material carbon black 1333-86-4 0.036 0.10 1000 plastics epoxy resin - 1.831 5.15 51509 inorganic material silicondioxide 60676-86-0 15.914 44.77 50.02 447579 500088 leadfinish non noble metal tin 7440-31-5 0.395 1.11 1.11 11117 11117 plating noble metal silver 7440-22-4 0.020 0.06 0.06 571 571 solder noble metal silver 7440-22-4 0.016 0.04 436 non noble metal tin 7440-31-5 0.012 0.03 349 non noble metal lead 7439-92-1 0.592 1.67 1.74 16660 17445 heat sink clip inorganic material phosphorus 7723-14-0 0.001 0.00 36 non noble metal zinc 7440-66-6 0.005 0.01 142 non noble metal iron 7439-89-6 0.101 0.28 2848 non noble metal copper 7440-50-8 4.112 11.57 11.86 115659 118685 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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